Bofeng Foam supplies XPE, IXPE and IXPP for electronics, where the material has to absorb shock, block static or hold a shape.
1. XPE Electronic Foam
- Material Properties
- Closed-cell, so it resists moisture.
- Light and flexible, with good cushioning.
- It resists corrosion and insulates electrically.
- Applications in Electronics
- Cushioning in electronics packaging.
- Thermal insulation in lithium battery encapsulation.
- Shock protection for electronic components.
- Sealing pads for instruments and gauges.
- Product Advantages
- It cushions and seals at once, in transit and in service.
2. IXPE Electronic Foam
- Material Characteristics
- Uniform, fine-cell structure.
- Anti-static, and permanently so.
- High resilience and durability.
- Applications in Electronics
- Anti-static packaging for semiconductor devices.
- Transport trays for precision circuit boards.
- Protective pads for electronic equipment.
- Protective films for optoelectronic displays.
- Product Advantages
- The anti-static property is in the material, not coated on.
3. IXPP Electronic Foam
- Material Properties
- High rigidity, so it gives structural support.
- Heat-resistant and dimensionally stable.
- It resists compression creep.
- Low outgassing.
- Applications in Electronics
- Structural support gaskets for precision instruments.
- Buffering components for automated equipment.
- Heat dissipation pads for electronic devices.
- Heavy-duty electronic equipment packaging.
- Product Advantages
- It holds its dimensions where a device runs warm.
Bofeng Foam supplies foam for the electronics industry. Contact us for product solutions and technical support.
Email: info@bofoam.com
