Electronic product packaging liner foam
Specification
  • Material: XPE foam, IXPE foam
  • Expansion ratio: 25 times (40 kg/m³), 30 times (33 kg/m³)
  • Thickness: single layer 1–12 mm, multi-layer 200 mm or less (thermal composite)
  • Colour: black and gray (colour can be customized)
  • Flame retardant grade: UL94 HF-1

Customization

Made to order: density, thickness, colour and shape to your drawing. Die-cutting, CNC routing, lamination to film or fabric, slitting and adhesive coating all run in-house, so the part we quote is a finished part, not just a sheet. How a custom part is cut and routed explains what to send with the drawing.

Regular material: MOQ 1,000 m², lead time 15–20 days from order confirmation. Custom parts are quoted from the drawing. A4 samples are free, shipping included.

Electronic products fail from the outside in. A screen cracks, a corner deforms, a port takes a knock — and the packaging is what decides whether any of that reaches the device. Bofeng die-cuts these inserts from XPE and IXPE foam, with cavities shaped to the exact outline of the product and its accessories, so the device is held on every face rather than resting on one.

Features

  • Custom cavities – die-cut to the exact outline of the device and each of its accessories.
  • Single or laminated build – 1–12 mm as a single layer, or thermally laminated up to 200 mm where deeper cushioning is needed.
  • Impact absorption – the closed-cell structure spreads shock away from screens, corners and ports.
  • Low added weight – protects the product without adding meaningful shipping weight.
  • Non-abrasive – a smooth surface that will not scuff housings or screen finishes.
  • Colour options – black and gray as standard, with other colours on request.

Applications

  • Phones and tablets – edge and screen protection for retail and e-commerce packaging.
  • Laptops – thicker pads set around the keyboard and behind the screen.
  • Cameras and lenses – separate cavities for the body and each accessory.
  • Games consoles and peripherals – fitted trays for consoles, controllers and headsets.
  • Components and boards – tray layers that separate and cushion assemblies in transit.

Specifications for electronic product packaging foam

A electronic product foam insert is a die-cut part, so the sheet has to hold a cavity, keep its thickness and cut cleanly.

FoamExpansionApparent densitySingle-layer thicknessWhy this grade
XPE10–20×50–100 kg/m³3–15 mm (heat-bonded 15–200 mm)The standard insert grade, because the insert is a visible part of the pack, so surface finish and colour are part of the specification. The 50–100 kg/m³ band holds a die-cut cavity and does not fatigue in a repeating transit cycle.
IXPE20–30×33.3–50 kg/m³0.1–15 mmFine-cell sheet for the lid liner and for thin interleaving between parts, where a firmer sheet would not close.

Base material specifications are on the XPE, IXPE and IXPP material pages; finished products are on the XPE foam and IXPE foam pages. Tell us the load, the space available and the service temperature and we will confirm the grade against your drawing.

Why Choose Bofeng Foam

  • Single layer 1–12 mm, thermally laminated up to 200 mm where needed.
  • Flame-retardant grade available – UL94 HF-1.
  • Black and gray as standard, other colours on request.
  • Die-cut to your device outline from a drawing or a physical sample.
  • Samples and specification sheets available before production.

Surface resistance versus volume resistance, and which one a packaging specification is actually asking for, is set out in our conductive foam and ESD guide.

Conclusion & Inquiry

Packaging foam covers the wider range of custom inserts and trays, and hardware packaging foam applies the same separation logic to metal parts. Contact us with your device dimensions and accessory list for a cut layout.